Two-Step Annealing Unlocks More Efficient and Reliable Silicon Carbide Devices
Published on Quantum Server Networks – Insights into the Future of Materials Science

In a significant leap forward for power electronics, researchers from the University of Osaka have developed a two-step annealing process that greatly enhances both the performance and reliability of silicon carbide (SiC) MOS devices. This breakthrough eliminates the need for problematic impurities like nitrogen, which have previously limited device efficiency and long-term stability. The findings, published in Applied Physics Express, could accelerate the adoption of SiC power electronics across electric vehicles, renewable energy systems, and next-generation industrial applications (TechXplore article).
Why Silicon Carbide Matters
Silicon carbide has emerged as a leading semiconductor material for high-power and high-frequency applications. Unlike traditional silicon, SiC can withstand higher voltages, temperatures, and switching frequencies, making it ideal for electric vehicle inverters, renewable energy converters, and grid infrastructure. The wide bandgap of SiC gives it an inherent advantage in efficiency and power density, critical for the global transition toward sustainable energy systems.
However, SiC MOSFETs (metal-oxide-semiconductor field-effect transistors) have long suffered from performance bottlenecks caused by defects at the SiC/SiO₂ interface. These defects degrade channel mobility and device reliability, hindering broader adoption despite SiC’s promising physical properties.
The Two-Step Annealing Solution
The Osaka research team, led by Prof. Takuma Kobayashi, addressed this issue with a clever thermal treatment. Their approach uses a diluted hydrogen annealing process performed in two stages: one before and one after gate oxide deposition. This dual-step technique reduces interface state density, eliminates unwanted impurities, and stabilizes the device under both positive and negative bias stress conditions.
Experimental results showed a significant boost in field-effect mobility, improved immunity against voltage stress, and reduced flat-band voltage drift – key metrics that directly translate into higher efficiency and operational reliability for SiC MOS devices.
“SiC MOS devices, despite being in mass production, haven’t yet reached their full potential in terms of performance and reliability. Our findings offer a solution to this long-standing challenge and open up exciting new possibilities for SiC power devices.” – Prof. Takuma Kobayashi
Implications for the Future of Power Electronics
This innovation has broad implications for industries worldwide. For electric vehicles, it means more efficient inverters and extended driving range. For renewable energy, it promises more reliable and scalable conversion systems. And in industrial automation and aerospace, improved SiC devices could enable more compact and energy-efficient power systems.
The annealing method is also compatible with existing semiconductor fabrication infrastructure, meaning it could be integrated into commercial processes without prohibitive costs. This increases the likelihood of rapid adoption in mass production environments.
Broader Context: The Push for Wide Bandgap Semiconductors
Silicon carbide is part of the broader class of wide bandgap semiconductors, alongside gallium nitride (GaN). Both materials are seen as critical enablers of the energy transition, with the potential to reduce global electricity losses and enhance efficiency across multiple sectors. The development of reliable and high-performance SiC MOSFETs is a cornerstone in this movement.
The University of Osaka’s contribution not only resolves a persistent challenge but also positions SiC technology for greater scalability and integration into everyday technologies, from charging infrastructure to high-speed trains.
Original research article: TechXplore – Two-step annealing process boosts silicon carbide device efficiency and reliability
This blog article was prepared with the help of AI technologies to enhance clarity, accessibility, and global outreach.
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